Problem resolution case studies
Airtight rubber headerCASE1
I want to make a connector connection to get signals from a board that is inside a unit that needs to be airtight.
We suggested a method of using rubber as the base of the header to make a connector connection while keeping the unit airtight.
Reflow heat countermeasureCASE2
For components that cannot withstand reflow heat, we have to mount them on the board after reflow. We want to reduce the number of man-hours for this process.
Mount a socket that matches the components’ lead pitch and pattern onto the board, then mount the components onto the socket after reflow.
Pitch conversion adapterCASE3
Our standard module lead pitch doesn’t match our customer’s motherboard pitch.
Connect to different pitch modules via a pitch conversion adapter connected to a pattern.
Pin header different shape from baseCASE4
When a header is attached to a circular board, the board needs to be made smaller, so there is a lot of dead space.
Make the base curved, maintaining the effective surface area and reducing the board size.
Because the header base uses substrate material CEM-3, it is freely customizable without any initial mold costs.